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NC210 Low Melt

NC210 Low Melt

B.L.T. Circuit Services

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NC210 is the latest generation of solderpaste reflowing at a lower temperature than standard lead free alloys, therefore making it the ideal solution when regular reflow temperatures are unacceptable. Alloy: 64Sn, 35Bi, 1Ag Flux content: 11% RMA Particle size: Type T4 20-38 Micron Request a quote

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The part other shops don't tell you. Three separate questions, kept separate on purpose, each with its source.