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SACP305

SACP305

B.L.T. Circuit Services

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LFB 305 is a Tin (96.5%), Silver (3.0%), Copper (0.5%) alloy. It is the most widely recognised out of all the SAC lead-free alloys. It has many approvals, including the JEIDA (Japan Electronic Industry Development Association) recommendation for leadfree soldering. The SAC 305 alloy exhibits superior properties than most lead-free alloys. It is ideally suited to the wave soldering process. The main features of the alloy are the fast wetting speed coupled with good drainage properties that result in excellent solderability. The alloy is manufactured at BLT using a nitrogen casting techniques; t

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The part other shops don't tell you. Three separate questions, kept separate on purpose, each with its source.