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Board Level EMI Shielding Cans

Board Level EMI Shielding Cans

SHIELDING SOLUTIONS LIMITED

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Board level EMI shielding cans are manufactured by photo etching or pressing thin metal sheet, which is then folded and soldered or tabbed to form the shielding can. Board level EMI shielding cans are manufactured by photo etching or pressing thin metal sheet, which is then folded and soldered or tabbed to form the shielding can. PCB shielding cans provide effective isolation of board level components. Photo etching is the most cost effective production method and being custom made, the cans can be manufactured to incorporate a range of design features to suit individual applications. Advantag

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